Trends in silicon germanium BiCMOS integration and reliability

J. Dunn, D. Harame, S. St. Onge, A. Joseph, N. Feilchenfeld, K. Watson, S. Subbanna, G. Freeman, S. Voldman, D. Ahlgren, R. Johnson
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引用次数: 19

Abstract

A base-after-gate integration scheme has been developed fora 0.25 /spl mu/m SiGe BiCMOS and the details of the approach are discussed. NPN device reliability is reviewed for high-frequency transistors. The reliability aspects associated with using SiGe for applications with high collector-base voltage with high emitter current are also explored. Finally, the ESD characteristics of the SiGe BiCMOS technology elements are summarized.
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硅锗BiCMOS集成与可靠性的发展趋势
针对0.25 /spl mu/m SiGe BiCMOS,提出了一种基-后-门集成方案,并对该方案进行了详细讨论。综述了高频晶体管NPN器件的可靠性。在高集电极基极电压和高发射极电流的应用中使用SiGe的可靠性方面也进行了探讨。最后,总结了SiGe BiCMOS技术元件的ESD特性。
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