K. Kukita, T. Uechi, J. Shimokawa, M. Goto, Y. Yokota, S. Kawanaka, T. Tanamoto, M. Koyama, H. Tanimoto, S. Takagi
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引用次数: 0
Abstract
TCAD simulations have been performed to optimize well designed planar single-gate silicon (Si) vertical tunneling junction field effect transistor (VTFET) with average subthreshold swing (S.S.) less than 60 mV/dec for 0.3 V (=Vgs=Vds) operation. By scaling the equivalent oxide thickness (EOT) and increasing the gate-to-source overlap length Lov, it achieved both on-current (Ion) greater than 1.0 A/m and low average S.S. without pocket doping for forming tunnel junction in conventional VTFET.
利用TCAD仿真优化了设计良好的平面单门硅垂直隧道结场效应晶体管(VTFET),在0.3 V (=Vgs=Vds)工作下,平均亚阈值摆幅(S.S.)小于60 mV/dec。通过缩放等效氧化物厚度(EOT)和增加栅极-源重叠长度Lov,可以在不掺杂口袋的情况下实现大于1.0A/m的导通电流和较低的平均S.S.,从而实现传统VTFET隧道结的形成。