Finite-Element Analysis of Strain Distribution in Ceramic Multilayer Capacitors during Wave Soldering and Reflow Soldering

Abstract

The strain distributions in the MLCC during the wave soldering are analyzed with the use of the birth-death element strategy. It is confirmed that the larger size of MLCC is more sensitive to the thermal shock of the wave soldering, while the increased preheating temperature could decrease the principal strain in all the MLCCs. The maximum strain occurs at the junction of the bottom end of the electrode termination and the dielectric ceramics.In compare, the strain distribution in the same size MLCC during the reflow soldering is computed, which indicated smaller principal strain and less thermal shock.