Analysis on the Thermal Fatigue Behavior of Single SnAgCu Solder Joint

Abstract

To verify whether the results of rapid thermal fatigue of solder joint are consistent with that of the conventional fatigue method, the repeated thermal cycling condition of alternating temperature should be created. In this paper, an experiment, which heat rapidly a metal boss under the single solder joint in 10 seconds by the induced eddy current effect of electromagnetic field and then stop to heat it at the same time in sequence, was implemented. That is to say, the single solder joint above the boss was heated and cooled through heat conduction of the boss where the heat quantity is generated by the electromagnetic induction heating. The condition of rapid thermal cycle was realized by this method. When the single solder joint was subjected to rapid thermal cycling, the interfacial microstructure between the solder ball and Cu substrate was observed and analyzed by SEM. The results indicated that this method supplying rapid heat source by induction heating is feasible to investigate the rapid thermal fatigue behavior of single solder joint. This method can provide more experience for fatigue failure to effectively improve the reliability of the electronic packaging devices.