Three-dimensional ceramic substrate prepared by repeated lithography and electroforming

2019 20th International Conference on Electronic Packaging Technology(ICEPT) Pub Date : 2019-08-01 DOI:10.1109/ICEPT47577.2019.245775

Zizhou Yang, Yang Peng, Hao-Chun Cheng, Chen Liu, Mingxiang Chen

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引用次数: 1

Abstract

In this work, three dimensional direct plated copper (3DPC) ceramic substrate prepared by repeated ultraviolet (UV) depth lithography and electroforming is proposed. The effects of different electroforming parameters including current density, stirring speed, and temperature were evaluated by internal stress and electroforming rate using a L9(34) orthogonal experiment. Range analysis and analysis of variance (ANOVA) were employed to estimate the contribution of each factor to the overall response. The optimal electrodeposition parameters were the current density of 4 ASD, the stirring speed of 1200 rpm, and the temperature of 50 °C. Furthermore, the microstructure, hermeticity, and thermal reliability of 3DPC substrate were researched. The results showed the 3DPC substrate had excellent hermeticity and the strong bonding strength between dam and flat DPC substrate even after 30 thermal cycles. The above results demonstrated that 3DPC substrate could be considered as a reliable substrate for UV-LED hermetic packaging.

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通过重复光刻和电铸制备三维陶瓷基板

本文提出了用重复紫外深度光刻和电铸法制备三维直接镀铜(3DPC)陶瓷基板。采用L9(34)正交试验，考察了电流密度、搅拌速度、温度等不同电铸参数对合金内应力和电铸速率的影响。采用极差分析和方差分析(ANOVA)来估计每个因素对总体反应的贡献。最佳电沉积参数为电流密度为4 ASD，搅拌速度为1200 rpm，温度为50℃。进一步研究了三维pc基板的微观结构、密封性和热可靠性。结果表明，经过30次热循环后，3DPC基板仍具有良好的密封性，且与平板DPC基板之间的粘结强度较强。以上结果表明，3DPC基板可以作为UV-LED密封封装的可靠基板。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2019 20th International Conference on Electronic Packaging Technology(ICEPT)

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