Yunheng Sun, Yufeng Jin, Han Cai, Shengli Ma, Liu-lin Hu, Shuwei He
{"title":"Design, fabrication and measurement of TSV interposer integrated X-band microstrip filter","authors":"Yunheng Sun, Yufeng Jin, Han Cai, Shengli Ma, Liu-lin Hu, Shuwei He","doi":"10.1109/ICEPT47577.2019.245748","DOIUrl":null,"url":null,"abstract":"In this paper, we present a TSV interposer integrated X-band microstrip filter. It designed as working at X band with an insertion loss (IL) of 2.2dB, measuring 2.8mm×3.7mm in size. With processed sample, the measured bandwidth (BW) is about 2.33GHz, the passband insertion loss is about 2.2dB.","PeriodicalId":6676,"journal":{"name":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","volume":"14 3 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 20th International Conference on Electronic Packaging Technology(ICEPT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT47577.2019.245748","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper, we present a TSV interposer integrated X-band microstrip filter. It designed as working at X band with an insertion loss (IL) of 2.2dB, measuring 2.8mm×3.7mm in size. With processed sample, the measured bandwidth (BW) is about 2.33GHz, the passband insertion loss is about 2.2dB.