Analytical Considerations of the TRL Calibration Procedure for General De-Embedding Purposes

U. Schumann, A. Jöstingmeier, A. Omar
{"title":"Analytical Considerations of the TRL Calibration Procedure for General De-Embedding Purposes","authors":"U. Schumann, A. Jöstingmeier, A. Omar","doi":"10.1109/ISSE.2019.8810268","DOIUrl":null,"url":null,"abstract":"In this paper, the suitability of the TRL calibration procedure as a technique for general de-embedding, i.e. in measurements and simulations, is examined. For the confirmation of the portability, simple test structures are examined purely analytically. Due to the character of this investigation, the behavior of the overall structure and the substructures is completely known and its applicability to general problems can be demonstrated.","PeriodicalId":6674,"journal":{"name":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","volume":"42 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 42nd International Spring Seminar on Electronics Technology (ISSE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2019.8810268","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

In this paper, the suitability of the TRL calibration procedure as a technique for general de-embedding, i.e. in measurements and simulations, is examined. For the confirmation of the portability, simple test structures are examined purely analytically. Due to the character of this investigation, the behavior of the overall structure and the substructures is completely known and its applicability to general problems can be demonstrated.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
一般去嵌入目的的TRL校准程序的分析考虑
本文考察了TRL校准程序作为一般去嵌入技术的适用性,即在测量和模拟中。为了确认可移植性,对简单的测试结构进行了纯粹的分析检验。由于这项研究的特点,整体结构和子结构的行为是完全已知的,可以证明其适用于一般问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Influence of Electric Current at Solidification of Solder Optimization of Cryogenic Deep Reactive Ion Etching Process for On-Chip Energy Storage Refined Approach on Controlling Heat Transfer in a Vapour Phase Soldering Oven Double Sided Printed Pattern Interconnected by Aerosol Jet and NCA Technologies New Possible Way for Brazing of Thick Film Cermet Conductors
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1