Mechanical vs. Electrical Properties of Conductive Adhesive Bonds as Function of Operating Temperature

Abstract

Solderless assembly for electronics is a subject approached ever since RoHS EU Directive enforced lead-free technology especially since this one has revealed its limits. Electrically Conductive Adhesives (ECA) actually with a large commercial offer but not very well characterized, became one of the alternatives to lead-free. The paper presents ECA qualification methods from mechanical and electrical properties point of view for usage as promising solution to build the electronic module, optimum on Surface Mount Technology processes or in the Occam concept using an additive process for interconnection structure. For a complete information about the bonds mechanical failure and their electrical resistance, shear tests, respectively four point electrical measurements were performed.