BA-BIST: Board test from inside the IC out

Z. Conroy, A. Crouch
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引用次数: 2

Abstract

With shrinking geometries of PCBs, increasing interface speeds and corresponding loss of test point access to diagnose structural test defects, new standard test mechanisms are needed to test chip-to-chip connectivity and functionality at the board level. New requirements for an integrated circuit `BA' (Board-Assist) BIST to structurally test these interfaces will be presented. A standardized BA-BIST template and algorithms for industry leverage are proposed.
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BA-BIST:从IC内到外的电路板测试
随着pcb的几何尺寸不断缩小,接口速度不断提高,以及相应的用于诊断结构测试缺陷的测试点访问损失,需要新的标准测试机制来测试片对片的连接性和板级功能。将提出对集成电路“BA”(Board-Assist) BIST进行结构测试的新要求。提出了行业杠杆的标准化BA-BIST模板和算法。
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