{"title":"BA-BIST: Board test from inside the IC out","authors":"Z. Conroy, A. Crouch","doi":"10.1109/TEST.2013.6651919","DOIUrl":null,"url":null,"abstract":"With shrinking geometries of PCBs, increasing interface speeds and corresponding loss of test point access to diagnose structural test defects, new standard test mechanisms are needed to test chip-to-chip connectivity and functionality at the board level. New requirements for an integrated circuit `BA' (Board-Assist) BIST to structurally test these interfaces will be presented. A standardized BA-BIST template and algorithms for industry leverage are proposed.","PeriodicalId":6379,"journal":{"name":"2013 IEEE International Test Conference (ITC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2013-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Test Conference (ITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.2013.6651919","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
With shrinking geometries of PCBs, increasing interface speeds and corresponding loss of test point access to diagnose structural test defects, new standard test mechanisms are needed to test chip-to-chip connectivity and functionality at the board level. New requirements for an integrated circuit `BA' (Board-Assist) BIST to structurally test these interfaces will be presented. A standardized BA-BIST template and algorithms for industry leverage are proposed.