{"title":"Sensor assembly method using Si-interposer with trenches for 3-D binocular range sensors","authors":"K. Nakajima","doi":"10.7567/SSDM.2017.PS-5-02","DOIUrl":null,"url":null,"abstract":"We devised an alignment method of two image sensors using a Si-interposer with trenches. The trench was formed using deep-reactive ion etching (RIE) equipment. We produced the 3-D range sensor using the method in our experiment and confirmed that sufficient alignment accuracy was realized.","PeriodicalId":22504,"journal":{"name":"The Japan Society of Applied Physics","volume":"82 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2017-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Japan Society of Applied Physics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.7567/SSDM.2017.PS-5-02","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract
We devised an alignment method of two image sensors using a Si-interposer with trenches. The trench was formed using deep-reactive ion etching (RIE) equipment. We produced the 3-D range sensor using the method in our experiment and confirmed that sufficient alignment accuracy was realized.
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