J. M. Gu, Paragkumar Thadesar, A. Dembla, S. Hong, M. Bakir, G. May
{"title":"Endpoint detection using optical emission spectroscopy in TSV fabrication","authors":"J. M. Gu, Paragkumar Thadesar, A. Dembla, S. Hong, M. Bakir, G. May","doi":"10.1109/IITC.2013.6615575","DOIUrl":null,"url":null,"abstract":"A hybrid partial least squares-support vector machine (PLS-SVM) model of optical emission spectroscopy data is proposed and successfully demonstrated to predict the endpoint detection of through silicon vias (TSVs) etched using the Bosch process. Accurate results are shown for TSVs with diameters of 80 μm and 25 μm.","PeriodicalId":6377,"journal":{"name":"2013 IEEE International Interconnect Technology Conference - IITC","volume":"4 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Interconnect Technology Conference - IITC","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2013.6615575","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A hybrid partial least squares-support vector machine (PLS-SVM) model of optical emission spectroscopy data is proposed and successfully demonstrated to predict the endpoint detection of through silicon vias (TSVs) etched using the Bosch process. Accurate results are shown for TSVs with diameters of 80 μm and 25 μm.
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