R. Tzeng, Yan-Pin Huang, Y. Chien, C. Chuang, W. Hwang, J. Chiou, M. Shy, Teu-Hua Lin, Kou-Hua Chen, C. Chiu, H. Tong, Kuan-Neng Chen
{"title":"Low temperature bonding of Sn/In-Cu interconnects for three-dimensional integration applications","authors":"R. Tzeng, Yan-Pin Huang, Y. Chien, C. Chuang, W. Hwang, J. Chiou, M. Shy, Teu-Hua Lin, Kou-Hua Chen, C. Chiu, H. Tong, Kuan-Neng Chen","doi":"10.1109/IITC.2013.6615572","DOIUrl":null,"url":null,"abstract":"A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.","PeriodicalId":6377,"journal":{"name":"2013 IEEE International Interconnect Technology Conference - IITC","volume":"60 1","pages":"1-3"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Interconnect Technology Conference - IITC","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2013.6615572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
A low temperature bonding technology of Sn/In composite solder bonded to Cu interconnect is proposed and investigated. The intermetallic compounds formed in the bonded interconnects can survive well in the following process. The Sn/In-Cu interconnects bonded at low temperature all exhibit excellent electrical performance and high resistance to multiple current stressing, showing a great potential in 3D applications.
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