OBTAINING OF A COMPOSITE COATING OF COPPER-MOLYBDENUM (VI) OXIDE WITH CATHODIC POLARIZATION

A. Bayeshov, М. Turlybekova, Aliya Tazhibayeva, A. Bayeshova, А. Zharmenov
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Abstract

In this paper, considered the ways of obtaining a composite electrochemical coating by entering molybdenum (VI) oxide into the copper matrix in order to improve the physicochemical properties of the copper coating. The influence of electrochemical parameters (solution concentration, current density, concentration of molybdenum (VI) oxide) is investigated with cathodic polarization of a titanium electrode in aqueous solutions of copper sulfate. In the course of studies of the influence of the concentration of a dispersed particle that is part of a copper-molybdenum oxide (VI) composite, it was found that at high concentrations of dispersed particles in solution, the cathode surface is passivated and the optimal concentration of the dispersed component is determined. It was noted that with increasing current density, the amount of molybdenum (VI) oxide penetrating into the copper matrix increases slightly, these data were explained by the charge difference of the particles, as well as adsorption properties. As a result of the study, a compact composite coating on the cathode in a dispersed suspension of the composite in a solution of copper (II) sulfate was obtained. The results of the physico-chemical analysis of the resulting composite coating showed that 1.2% dispersed molybdenum (VI) oxide entered the copper matrix. As a result of tests of a composite coating made of copper-molybdenum oxide for chemical corrosion, it was found that this coating has high corrosion resistance from a copper coating obtained without molybdenum (VI) oxide. The surface roughness of the coating obtained on the cathode surface was observed in microphotographs. This was explained by the fact that molybdenum (VI) oxide penetrates into the copper matrix in the form of dispersed granules and forms a composite electrochemical shell with a copper coating.
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阴极极化氧化铜钼复合涂层的制备
为了提高铜镀层的理化性能,本文研究了在铜基体中加入钼(VI)氧化物制备复合电化学镀层的方法。利用钛电极在硫酸铜水溶液中的阴极极化,研究了电化学参数(溶液浓度、电流密度、钼(VI)氧化物浓度)的影响。在研究氧化铜钼(VI)复合材料中分散颗粒浓度的影响过程中,发现溶液中分散颗粒浓度高时,阴极表面钝化,并确定了分散组分的最佳浓度。结果表明,随着电流密度的增加,钼(VI)氧化物渗透到铜基体中的量略有增加,这可以用粒子的电荷差异和吸附特性来解释。研究结果表明,在硫酸铜(II)溶液中,在复合材料的分散悬浮液中,阴极上获得了致密的复合涂层。对复合镀层的理化分析结果表明,有1.2%的分散钼(VI)氧化物进入了铜基体。通过对铜钼氧化物复合涂层的化学腐蚀试验,发现该涂层比不含钼(VI)氧化物的铜涂层具有更高的耐腐蚀性。用显微照片观察了阴极表面镀层的表面粗糙度。这是由于钼(VI)氧化物以分散颗粒的形式渗透到铜基体中,并形成具有铜涂层的复合电化学壳。
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