{"title":"Where does memory go in the 21C? (Evolution and revolution of memory technology)","authors":"C. Hwang","doi":"10.1109/VLSIC.2000.852859","DOIUrl":null,"url":null,"abstract":"For the new millennium, several \"third\" dimensional approaches in the memory area will take place with continuous revolutionary development from current technologies for various customers' demands. In the mean time, various and combined evolutionary technologies such as micro-machining technology, multi-chip stacking techniques, mixed digital/analog circuits, merged memories on a chip, cloning and genetics, biochemistry and magnetics areas are awaiting a breakthrough and will be pursued toward the generic memory goals of high density, high speed and low power more closely.","PeriodicalId":6361,"journal":{"name":"2000 Symposium on VLSI Circuits. Digest of Technical Papers (Cat. No.00CH37103)","volume":"1 1","pages":"88-91"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2000 Symposium on VLSI Circuits. Digest of Technical Papers (Cat. No.00CH37103)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIC.2000.852859","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
For the new millennium, several "third" dimensional approaches in the memory area will take place with continuous revolutionary development from current technologies for various customers' demands. In the mean time, various and combined evolutionary technologies such as micro-machining technology, multi-chip stacking techniques, mixed digital/analog circuits, merged memories on a chip, cloning and genetics, biochemistry and magnetics areas are awaiting a breakthrough and will be pursued toward the generic memory goals of high density, high speed and low power more closely.