Nonlocal dual-phase-lag thermoviscoelastic response of a polymer microbeam incorporating modified couple stress and fractional viscoelastic theories

IF 1.4 4区 工程技术 Q3 ENGINEERING, MECHANICAL Journal of Strain Analysis for Engineering Design Pub Date : 2022-09-12 DOI:10.1177/03093247221122691
Wei Peng, Zezhang Qi, Tianhu He
{"title":"Nonlocal dual-phase-lag thermoviscoelastic response of a polymer microbeam incorporating modified couple stress and fractional viscoelastic theories","authors":"Wei Peng, Zezhang Qi, Tianhu He","doi":"10.1177/03093247221122691","DOIUrl":null,"url":null,"abstract":"Ultra-slow relaxation process of polymers has the memory-dependent feature, integer-order thermoviscoelastic models may fail to describe the dynamic behaviors of viscoelastic structures accurately. Additionally, it is noticed that the small-scale effect of elastic deformation and heat conduction in a non-isothermal temperature environment is becoming significant due to the development of micro-devices. To better capture the memory-dependent effect and the small-scale effect of viscoelastic micro-structures in heat transfer environment, as a first attempt, present work focuses on developing a refined fractional Kelvin-Voigt thermoviscoelastic model by incorporating the nonlocal dual-phase-lag (NDPL) heat conduction model and the modified coupled stress theory (MCST). Then, the model is applied to investigating the transient response of a polymer microbeam subjected to a harmonic thermal loading. The governing equations involving the modified parameters are formulated and then solved by Laplace transform method. Some parametric results are demonstrated to display the impacts of the nonlocal thermal parameter, the material length-scale parameter and the fractional-order parameter on the considered physical quantities. The results show that the small-scale effect and the memory-dependent effects strongly depend on the polymer micro-structure characteristics in thermal environment.","PeriodicalId":50038,"journal":{"name":"Journal of Strain Analysis for Engineering Design","volume":null,"pages":null},"PeriodicalIF":1.4000,"publicationDate":"2022-09-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Strain Analysis for Engineering Design","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1177/03093247221122691","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MECHANICAL","Score":null,"Total":0}
引用次数: 0

Abstract

Ultra-slow relaxation process of polymers has the memory-dependent feature, integer-order thermoviscoelastic models may fail to describe the dynamic behaviors of viscoelastic structures accurately. Additionally, it is noticed that the small-scale effect of elastic deformation and heat conduction in a non-isothermal temperature environment is becoming significant due to the development of micro-devices. To better capture the memory-dependent effect and the small-scale effect of viscoelastic micro-structures in heat transfer environment, as a first attempt, present work focuses on developing a refined fractional Kelvin-Voigt thermoviscoelastic model by incorporating the nonlocal dual-phase-lag (NDPL) heat conduction model and the modified coupled stress theory (MCST). Then, the model is applied to investigating the transient response of a polymer microbeam subjected to a harmonic thermal loading. The governing equations involving the modified parameters are formulated and then solved by Laplace transform method. Some parametric results are demonstrated to display the impacts of the nonlocal thermal parameter, the material length-scale parameter and the fractional-order parameter on the considered physical quantities. The results show that the small-scale effect and the memory-dependent effects strongly depend on the polymer micro-structure characteristics in thermal environment.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
结合修正偶应力和分数粘弹性理论的聚合物微梁非局部双相滞后热粘弹性响应
聚合物的超慢弛豫过程具有记忆依赖性,整阶热粘弹性模型可能无法准确描述粘弹性结构的动力学行为。此外,由于微器件的发展,在非等温温度环境下,弹性变形和热传导的小尺度效应变得越来越重要。为了更好地捕捉热传递环境中粘弹性微观结构的记忆依赖效应和小尺度效应,本文首次尝试将非局部双相滞后(NDPL)热传导模型和修正耦合应力理论(MCST)结合起来,建立了精细分数阶Kelvin-Voigt热粘弹性模型。然后,将该模型应用于聚合物微梁在谐波热载荷作用下的瞬态响应研究。建立了包含修改参数的控制方程,并用拉普拉斯变换法求解。一些参数结果显示了非局部热参数、材料长度尺度参数和分数阶参数对所考虑的物理量的影响。结果表明,热环境下聚合物的微观结构特性对小尺度效应和记忆依赖效应有很大的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Journal of Strain Analysis for Engineering Design
Journal of Strain Analysis for Engineering Design 工程技术-材料科学:表征与测试
CiteScore
3.50
自引率
6.20%
发文量
25
审稿时长
>12 weeks
期刊介绍: The Journal of Strain Analysis for Engineering Design provides a forum for work relating to the measurement and analysis of strain that is appropriate to engineering design and practice. "Since launching in 1965, The Journal of Strain Analysis has been a collegiate effort, dedicated to providing exemplary service to our authors. We welcome contributions related to analytical, experimental, and numerical techniques for the analysis and/or measurement of stress and/or strain, or studies of relevant material properties and failure modes. Our international Editorial Board contains experts in all of these fields and is keen to encourage papers on novel techniques and innovative applications." Professor Eann Patterson - University of Liverpool, UK This journal is a member of the Committee on Publication Ethics (COPE).
期刊最新文献
Anti-plane analysis of a crack terminating at interface of the isotropic half-planes bonded to intact orthotropic layers Compressive performance of paper honeycomb core layer with double-hole in cell walls A novel multiaxial fatigue life prediction model based on the critical plane theory and machine-learning method Non-linear analysis of the flexural-torsional stability of slender tropical glulam beams Approximate methods for contact problems involving beams
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1