BSIM-CMG: Standard FinFET compact model for advanced circuit design

J. Duarte, S. Khandelwal, A. Medury, C. Hu, P. Kushwaha, H. Agarwal, A. Dasgupta, Y. Chauhan
{"title":"BSIM-CMG: Standard FinFET compact model for advanced circuit design","authors":"J. Duarte, S. Khandelwal, A. Medury, C. Hu, P. Kushwaha, H. Agarwal, A. Dasgupta, Y. Chauhan","doi":"10.1109/ESSCIRC.2015.7313862","DOIUrl":null,"url":null,"abstract":"This work presents new compact models that capture advanced physical effects presented in industry FinFETs. The presented models are introduced into the industry standard compact model BSIM-CMG. The core model is updated with a new unified FinFET model, which calculates charges and currents of transistors with complex fin cross-sections. In addition, threshold voltage modulation from bulk-bias effects and bias dependent quantum mechanical confinement effects are incorporated into the new core model. Short channel effects, affecting threshold voltage and subhtreshold swing, are modeled with a new unified field penetration length, enabling accurate 14nm node FinFET modeling. The new proposed models further assure the BSIM-CMG model's capabilities for circuit design using FinFET transistors for advanced technology nodes.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":"28 1","pages":"196-201"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"55","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC.2015.7313862","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 55

Abstract

This work presents new compact models that capture advanced physical effects presented in industry FinFETs. The presented models are introduced into the industry standard compact model BSIM-CMG. The core model is updated with a new unified FinFET model, which calculates charges and currents of transistors with complex fin cross-sections. In addition, threshold voltage modulation from bulk-bias effects and bias dependent quantum mechanical confinement effects are incorporated into the new core model. Short channel effects, affecting threshold voltage and subhtreshold swing, are modeled with a new unified field penetration length, enabling accurate 14nm node FinFET modeling. The new proposed models further assure the BSIM-CMG model's capabilities for circuit design using FinFET transistors for advanced technology nodes.
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BSIM-CMG:用于高级电路设计的标准FinFET紧凑模型
这项工作提出了新的紧凑模型,捕捉工业finfet中出现的先进物理效应。所提出的模型被引入到工业标准紧凑模型BSIM-CMG中。核心模型更新为新的统一FinFET模型,该模型计算具有复杂翅片截面的晶体管的电荷和电流。此外,从体偏置效应和偏置相关的量子力学约束效应的阈值电压调制被纳入新的核心模型。影响阈值电压和亚阈值摆幅的短通道效应采用新的统一场穿透长度进行建模,从而实现精确的14nm节点FinFET建模。新提出的模型进一步保证了BSIM-CMG模型使用FinFET晶体管进行先进技术节点电路设计的能力。
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