J. Duarte, S. Khandelwal, A. Medury, C. Hu, P. Kushwaha, H. Agarwal, A. Dasgupta, Y. Chauhan
{"title":"BSIM-CMG: Standard FinFET compact model for advanced circuit design","authors":"J. Duarte, S. Khandelwal, A. Medury, C. Hu, P. Kushwaha, H. Agarwal, A. Dasgupta, Y. Chauhan","doi":"10.1109/ESSCIRC.2015.7313862","DOIUrl":null,"url":null,"abstract":"This work presents new compact models that capture advanced physical effects presented in industry FinFETs. The presented models are introduced into the industry standard compact model BSIM-CMG. The core model is updated with a new unified FinFET model, which calculates charges and currents of transistors with complex fin cross-sections. In addition, threshold voltage modulation from bulk-bias effects and bias dependent quantum mechanical confinement effects are incorporated into the new core model. Short channel effects, affecting threshold voltage and subhtreshold swing, are modeled with a new unified field penetration length, enabling accurate 14nm node FinFET modeling. The new proposed models further assure the BSIM-CMG model's capabilities for circuit design using FinFET transistors for advanced technology nodes.","PeriodicalId":11845,"journal":{"name":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","volume":"28 1","pages":"196-201"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"55","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ESSCIRC Conference 2015 - 41st European Solid-State Circuits Conference (ESSCIRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC.2015.7313862","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 55
Abstract
This work presents new compact models that capture advanced physical effects presented in industry FinFETs. The presented models are introduced into the industry standard compact model BSIM-CMG. The core model is updated with a new unified FinFET model, which calculates charges and currents of transistors with complex fin cross-sections. In addition, threshold voltage modulation from bulk-bias effects and bias dependent quantum mechanical confinement effects are incorporated into the new core model. Short channel effects, affecting threshold voltage and subhtreshold swing, are modeled with a new unified field penetration length, enabling accurate 14nm node FinFET modeling. The new proposed models further assure the BSIM-CMG model's capabilities for circuit design using FinFET transistors for advanced technology nodes.