A pattern mining framework for inter-wafer abnormality analysis

Abstract

This work presents three pattern mining methodologies for inter-wafer abnormality analysis. Given a large population of wafers, the first methodology identifies wafers with abnormal patterns based on a test or a group of tests. Given a wafer of interest, the second methodology searches for a test perspective that reveals the abnormality of the wafer. Given a particular pattern of interest, the third methodology implements a monitor to detect wafers containing similar patterns. This paper discusses key elements for implementing each of the methodologies and demonstrates their usefulness based on experiments applied to a high-quality SoC product line.