军用PEM评估方法的超温研究

Xuliang Wang, Y. Liang
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引用次数: 0

摘要

为了评估军用塑料封装微电路(PEM)的超温可靠性,通过分析PEM (Plastic encapsulation Microcircuit)的失效模式和失效机理,设计了模拟PEM (Plastic encapsulation Microcircuit)环境适应性和寿命的试验。在此基础上,设计并进行了评价试验,结果表明,可选择在工作条件下但在最高温度限制下的高加速应力温度试验、温度循环试验和稳态寿命试验来依次评价超温装置的可靠性。为PEM过温使用提供了一套可行的评价方法,可以有效地保证PEM的质量和可靠性,也为后续形成PEM过温使用的筛选和检测的有效评价方法和标准提供了理论依据。
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Research on Over-Temperature using of PEM Evaluation Method in Military
In order to evaluate the reliability of over-temperature using of Plastic Encapsulated Microcircuit (PEM) in military, this paper designs tests to simulate environmental suitability and lifetime by analyzing the failure mode and mechanism of PEM (the plastic encapsulated microcircuit). Based on the analysis, the evaluating tests are designed and conducted, and the result shows that HAST (High accelerated stress temperature), temperature cycling, and Steady state life test under the operating condition but within the maximum temperature limit, can be chosen to evaluate the reliability of the devices used over-temperature in sequence. This provides a set of feasible evaluation methods for the over-temperature using of PEM, which can effectively guarantee the quality and reliability of PEM, also provides theoretical basis for the subsequent formation of effective evaluation methods and standards for the screening and detection of the overtemperature using of PEM.
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