用非穿透四点探头精确测定超浅结片电阻

R. Hillard, J. Borland, C. Win Ye
{"title":"用非穿透四点探头精确测定超浅结片电阻","authors":"R. Hillard, J. Borland, C. Win Ye","doi":"10.1109/IWJT.2004.1306768","DOIUrl":null,"url":null,"abstract":"An accurate method to measure the four point probe (4pp) sheet resistance (R/sub S/) of USJ Source-Drain structures is described. The new method utilizes Elastic Material gate (EM-gate) probes to form non-penetrating contacts to the silicon surface. The probe design is kinematic and the force controlled to ensure elastic deformation of the probe material. The probe material is selected so that large direct tunneling (DT) currents can flow through the native oxide thereby forming a low impedance contact. In this paper, the new 4pp will be demonstrated on a variety of implanted USJ structures.","PeriodicalId":342825,"journal":{"name":"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.","volume":"62 10","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Accurate determination of ultra-shallow junction sheet resistance with a non-penetrating four point probe\",\"authors\":\"R. Hillard, J. Borland, C. Win Ye\",\"doi\":\"10.1109/IWJT.2004.1306768\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An accurate method to measure the four point probe (4pp) sheet resistance (R/sub S/) of USJ Source-Drain structures is described. The new method utilizes Elastic Material gate (EM-gate) probes to form non-penetrating contacts to the silicon surface. The probe design is kinematic and the force controlled to ensure elastic deformation of the probe material. The probe material is selected so that large direct tunneling (DT) currents can flow through the native oxide thereby forming a low impedance contact. In this paper, the new 4pp will be demonstrated on a variety of implanted USJ structures.\",\"PeriodicalId\":342825,\"journal\":{\"name\":\"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.\",\"volume\":\"62 10\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWJT.2004.1306768\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"The Fourth International Workshop on Junction Technology, 2004. IWJT '04.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWJT.2004.1306768","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

摘要

介绍了一种精确测量USJ源漏结构四点探头(4pp)片电阻(R/sub / S/)的方法。新方法利用弹性材料栅极(EM-gate)探头与硅表面形成非穿透接触。探头的设计是运动学的,力是可控的,以保证探头材料的弹性变形。探头材料的选择使得大的直接隧道(DT)电流可以流过天然氧化物,从而形成低阻抗接触。在本文中,新的4pp将在各种植入USJ结构上进行演示。
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Accurate determination of ultra-shallow junction sheet resistance with a non-penetrating four point probe
An accurate method to measure the four point probe (4pp) sheet resistance (R/sub S/) of USJ Source-Drain structures is described. The new method utilizes Elastic Material gate (EM-gate) probes to form non-penetrating contacts to the silicon surface. The probe design is kinematic and the force controlled to ensure elastic deformation of the probe material. The probe material is selected so that large direct tunneling (DT) currents can flow through the native oxide thereby forming a low impedance contact. In this paper, the new 4pp will be demonstrated on a variety of implanted USJ structures.
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