H. Herrmann, W. Horchler, S. Schwarz, Philipp Schroeter, F. Klotz, Marco Brignone, F. Fiori
{"title":"用于DPI分析的智能电源IC宏建模","authors":"H. Herrmann, W. Horchler, S. Schwarz, Philipp Schroeter, F. Klotz, Marco Brignone, F. Fiori","doi":"10.1109/EMCCOMPO.2015.7358365","DOIUrl":null,"url":null,"abstract":"This paper deals with the susceptibility to radio frequency interference of smart power integrated circuits. A method to perform simulations aimed at evaluating the performance of subcircuits included in a more complex IC in the presence of EMI is presented. Referring to this, the behaviour of a current sensor included into a high-side power switch during DPI test is investigated. The results of simulation analyses and DPI tests are presented.","PeriodicalId":236992,"journal":{"name":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","volume":"57 1-2","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Smart power IC macromodeling for DPI analysis\",\"authors\":\"H. Herrmann, W. Horchler, S. Schwarz, Philipp Schroeter, F. Klotz, Marco Brignone, F. Fiori\",\"doi\":\"10.1109/EMCCOMPO.2015.7358365\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper deals with the susceptibility to radio frequency interference of smart power integrated circuits. A method to perform simulations aimed at evaluating the performance of subcircuits included in a more complex IC in the presence of EMI is presented. Referring to this, the behaviour of a current sensor included into a high-side power switch during DPI test is investigated. The results of simulation analyses and DPI tests are presented.\",\"PeriodicalId\":236992,\"journal\":{\"name\":\"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"volume\":\"57 1-2\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMCCOMPO.2015.7358365\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits (EMC Compo)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCCOMPO.2015.7358365","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper deals with the susceptibility to radio frequency interference of smart power integrated circuits. A method to perform simulations aimed at evaluating the performance of subcircuits included in a more complex IC in the presence of EMI is presented. Referring to this, the behaviour of a current sensor included into a high-side power switch during DPI test is investigated. The results of simulation analyses and DPI tests are presented.
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