集成电路芯片冷却用单片微通道的制备

Youngcheol Joo, Kiet Dieu, C. Kim
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引用次数: 33

摘要

提出了一种制备微电子芯片冷却用微通道的新方法。以厚光刻胶为牺牲模,采用微电镀工艺制备通道。通过在密封完成前移除光刻胶模具,只需一个掩模即可制作通道。本文给出的通道的横截面为5-10 pm宽,8-10 pm高。这种方法解决了从极长通道(例如,长宽比高达千)内部取出模具的问题。与其他制造微通道的方法不同,这种方法可以集成到现有的IC工艺中,并提供了一种实用的方法来冷却带有微通道的IC芯片。
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Fabrication of monolithic microchannels for IC chip cooling
A novel method to fabricate microchannels to be used in microelectronics chip cooling has been developed. The channels are made by microelectroplating with thick photoresist as the sacrificial molds. By removing the photoresist mold before sealing is completed, the channel can be made with only one mask. The cross section of the channels presented in the paper are 5-10 pm wide and 8-10 pm high. This method solves the problem of removing the mold from inside the extremely long channels (e.g., length-to-width ratio as large as a thousand). Unlike other methods for fabrication of microchannels, this method can be integrated into existing IC processes and delivers a practical way to cool IC chips with microchannels.
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