x波段操作下AlGaN/GaN高电子迁移率晶体管的降解

E. Douglas, S. Pearton, B. Poling, F. Ren, E. Heller, D. Via
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引用次数: 1

摘要

栅极长度为0.125µm的AlGaN/GaN hemt在AB类条件下,在3db压缩下,在10 GHz下承受长达350小时的应力。器件表现出优异的射频稳定性,直至漏极偏压为20 V。在漏极偏压为25 V时,观察到快速降解。在所有三种偏置条件下观察到大量的肖特基接触退化。电致发光表明沿通道长度的局部失效点,微光致发光表明失效区域非辐射陷阱形成的增加。
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Degradation of AlGaN/GaN High Electron Mobility Transistors from X-Band Operation
AlGaN/GaN HEMTs with a gate length of 0.125 µm were stressed at Class AB condition, 10 GHz under 3 dB compression for up to 350 hours. Devices exhibited excellent RF stability up to a drain bias of 20 V. Rapid degradation was observed for a drain bias of 25 V. Substantial Schottky contact degradation was observed for all three bias conditions. Electroluminescence indicates localized points of failure along the channel length, and micro- photoluminescence indicates an increase in non- radiative trap formation in regions of failure.
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