{"title":"铜互连失效——定位、分析和退化机制","authors":"E. Zschech, E. Langer, M. Meyer","doi":"10.1109/IPFA.2003.1222735","DOIUrl":null,"url":null,"abstract":"In this paper, we focussed about the failures in copper interconnects and on analytical techniques that are applied for physical failure analysis. Electromigration test structure after partial degradation by voiding was observed using SEM images.","PeriodicalId":266326,"journal":{"name":"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2003-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Failures in copper interconnects-localization, analysis and degradation mechanisms\",\"authors\":\"E. Zschech, E. Langer, M. Meyer\",\"doi\":\"10.1109/IPFA.2003.1222735\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we focussed about the failures in copper interconnects and on analytical techniques that are applied for physical failure analysis. Electromigration test structure after partial degradation by voiding was observed using SEM images.\",\"PeriodicalId\":266326,\"journal\":{\"name\":\"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-07-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2003.1222735\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2003.1222735","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Failures in copper interconnects-localization, analysis and degradation mechanisms
In this paper, we focussed about the failures in copper interconnects and on analytical techniques that are applied for physical failure analysis. Electromigration test structure after partial degradation by voiding was observed using SEM images.
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