K. Nakao, T. Asano, H. Fukushima, H. Yamamoto, A. Dip, R. Joe, D. O'Meara, R. Soave, S. Kaushal
{"title":"多晶圆快速等温加工","authors":"K. Nakao, T. Asano, H. Fukushima, H. Yamamoto, A. Dip, R. Joe, D. O'Meara, R. Soave, S. Kaushal","doi":"10.1109/ISSM.2001.962935","DOIUrl":null,"url":null,"abstract":"A new concept in multi-wafer (MW) rapid thermal processing (RTP) is presented. An innovative approach to hot-wall, isothermal processing technology advances the conventional large batch environment into the realm of RTP processing. Using recent developments in heater technology along with advancements in other critical processing areas, a method for processing a lot (25 wafers) within an hour in a hot-wall RTP environment is demonstrated.","PeriodicalId":356225,"journal":{"name":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Multi-wafer rapid isothermal processing\",\"authors\":\"K. Nakao, T. Asano, H. Fukushima, H. Yamamoto, A. Dip, R. Joe, D. O'Meara, R. Soave, S. Kaushal\",\"doi\":\"10.1109/ISSM.2001.962935\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new concept in multi-wafer (MW) rapid thermal processing (RTP) is presented. An innovative approach to hot-wall, isothermal processing technology advances the conventional large batch environment into the realm of RTP processing. Using recent developments in heater technology along with advancements in other critical processing areas, a method for processing a lot (25 wafers) within an hour in a hot-wall RTP environment is demonstrated.\",\"PeriodicalId\":356225,\"journal\":{\"name\":\"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)\",\"volume\":\"94 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-10-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSM.2001.962935\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 IEEE International Symposium on Semiconductor Manufacturing. ISSM 2001. Conference Proceedings (Cat. No.01CH37203)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSM.2001.962935","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A new concept in multi-wafer (MW) rapid thermal processing (RTP) is presented. An innovative approach to hot-wall, isothermal processing technology advances the conventional large batch environment into the realm of RTP processing. Using recent developments in heater technology along with advancements in other critical processing areas, a method for processing a lot (25 wafers) within an hour in a hot-wall RTP environment is demonstrated.
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