CMOS和MEMS传感器的晶圆级封装和异构系统集成方法

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947409

S. Dempwolf, L. Hofmann, Christopher Bowers, D. Guenther, R. Knechtel, S. Schulz, R. Gerbach

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摘要

本文介绍了CMOS和MEMS传感器的三维集成方法。它意味着晶圆级封装，硅通孔(TSV)和异质系统集成的新方法，如微转移印刷。这些技术在传感器设备上进行了描述。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors

This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer-printing. These technologies are described on sensor devices.

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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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