{"title":"一种确定性统计多缺陷诊断方法","authors":"Soumya Mittal, R. D. Blanton","doi":"10.1109/VTS48691.2020.9107603","DOIUrl":null,"url":null,"abstract":"Software diagnosis is the process of locating and characterizing a defect in a failing chip. It is the cornerstone of failure analysis that consequently enables yield learning and monitoring. However, multiple-defect diagnosis is challenging due to error masking and unmasking effects, and exponential complexity of the solution search process. This paper describes a three-phase, physically-aware diagnosis methodology called MDLearnX to effectively diagnose multiple defects, and in turn, aid in accelerating the design and process development. The first phase identifies a defect that resembles traditional fault models. The second and the third phases utilize the X-fault model and machine learning to identify correct candidates. Results from a thorough fault injection and simulation experiment demonstrate that MD-LearnX returns an ideal diagnosis 2X more often than commercial diagnosis. Its effectiveness is further evidenced through a silicon experiment, where, on average, MD-LearnX returns 5.3 fewer candidates per diagnosis as compared to state-of-the-art commercial diagnosis without losing accuracy.","PeriodicalId":326132,"journal":{"name":"2020 IEEE 38th VLSI Test Symposium (VTS)","volume":"146 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Deterministic-Statistical Multiple-Defect Diagnosis Methodology\",\"authors\":\"Soumya Mittal, R. D. Blanton\",\"doi\":\"10.1109/VTS48691.2020.9107603\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Software diagnosis is the process of locating and characterizing a defect in a failing chip. It is the cornerstone of failure analysis that consequently enables yield learning and monitoring. However, multiple-defect diagnosis is challenging due to error masking and unmasking effects, and exponential complexity of the solution search process. This paper describes a three-phase, physically-aware diagnosis methodology called MDLearnX to effectively diagnose multiple defects, and in turn, aid in accelerating the design and process development. The first phase identifies a defect that resembles traditional fault models. The second and the third phases utilize the X-fault model and machine learning to identify correct candidates. Results from a thorough fault injection and simulation experiment demonstrate that MD-LearnX returns an ideal diagnosis 2X more often than commercial diagnosis. Its effectiveness is further evidenced through a silicon experiment, where, on average, MD-LearnX returns 5.3 fewer candidates per diagnosis as compared to state-of-the-art commercial diagnosis without losing accuracy.\",\"PeriodicalId\":326132,\"journal\":{\"name\":\"2020 IEEE 38th VLSI Test Symposium (VTS)\",\"volume\":\"146 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE 38th VLSI Test Symposium (VTS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VTS48691.2020.9107603\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE 38th VLSI Test Symposium (VTS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VTS48691.2020.9107603","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A Deterministic-Statistical Multiple-Defect Diagnosis Methodology
Software diagnosis is the process of locating and characterizing a defect in a failing chip. It is the cornerstone of failure analysis that consequently enables yield learning and monitoring. However, multiple-defect diagnosis is challenging due to error masking and unmasking effects, and exponential complexity of the solution search process. This paper describes a three-phase, physically-aware diagnosis methodology called MDLearnX to effectively diagnose multiple defects, and in turn, aid in accelerating the design and process development. The first phase identifies a defect that resembles traditional fault models. The second and the third phases utilize the X-fault model and machine learning to identify correct candidates. Results from a thorough fault injection and simulation experiment demonstrate that MD-LearnX returns an ideal diagnosis 2X more often than commercial diagnosis. Its effectiveness is further evidenced through a silicon experiment, where, on average, MD-LearnX returns 5.3 fewer candidates per diagnosis as compared to state-of-the-art commercial diagnosis without losing accuracy.