{"title":"一个10位高速CMOS CAS宏单元","authors":"A. W. Vogt, I. Dedic","doi":"10.1109/CICC.1989.56703","DOIUrl":null,"url":null,"abstract":"A 10-bit 50 M-sample/s digital-to-analog converter has been fabricated in a 3-μm, double-metal, single-polysilicon CMOS process. The architecture of the converter was chosen to minimize the effects of chip gradients, mismatches and transistor parameters, voltage drops in supply tracks, and other nonideal effects. Close attention was paid to the dynamic behavior of the converter to reduce output glitches and code-dependent distortion","PeriodicalId":165054,"journal":{"name":"1989 Proceedings of the IEEE Custom Integrated Circuits Conference","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A 10-bit high speed CMOS CAS macrocell\",\"authors\":\"A. W. Vogt, I. Dedic\",\"doi\":\"10.1109/CICC.1989.56703\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A 10-bit 50 M-sample/s digital-to-analog converter has been fabricated in a 3-μm, double-metal, single-polysilicon CMOS process. The architecture of the converter was chosen to minimize the effects of chip gradients, mismatches and transistor parameters, voltage drops in supply tracks, and other nonideal effects. Close attention was paid to the dynamic behavior of the converter to reduce output glitches and code-dependent distortion\",\"PeriodicalId\":165054,\"journal\":{\"name\":\"1989 Proceedings of the IEEE Custom Integrated Circuits Conference\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1989 Proceedings of the IEEE Custom Integrated Circuits Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/CICC.1989.56703\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1989 Proceedings of the IEEE Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1989.56703","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 10-bit 50 M-sample/s digital-to-analog converter has been fabricated in a 3-μm, double-metal, single-polysilicon CMOS process. The architecture of the converter was chosen to minimize the effects of chip gradients, mismatches and transistor parameters, voltage drops in supply tracks, and other nonideal effects. Close attention was paid to the dynamic behavior of the converter to reduce output glitches and code-dependent distortion