石墨烯涂层铜基板上纳米银烧结模接UV LED模组的热模拟

Pan Liu, Yong Li, Xiaobin Jian, Chen Jing, Min Li, S. Ding, Guoqi Zhang
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引用次数: 2

摘要

在固化、水净化和其他需要高光输出的应用中,高功率紫外线(UV) led的工业市场一直在增长。根据经验,在典型工作温度范围内工作时,温度每增加1°C, LED流明输出通常会下降0.3-0.5%。对大功率UV LED模块的这些要求表明,需要创新的模块封装材料和工艺来降低导热性并确保高可靠性。在这项工作中,选择了UVA(波长在365-405nm之间)led,因为在干燥油漆,粘合剂和其他可固化材料的固化设备中使用越来越多。为了降低UVA LED封装的热导率,对基于高功率UV板上芯片(COB)的LED模组进行了仿真。与传统的填充银胶粘剂和金属芯印刷电路板(MCPCB)衬底的模块相比,新型高功率UV COB模块采用纳米银材料进行贴模工艺。这种银烧结方法在大功率电子器件的应用中正在兴起。然后将这种衬底烧结在铜散热器上,铜散热器上覆盖一层薄薄的石墨烯,以便更好地进行热管理。利用ABAQUS软件和传热模块对这种新型结构进行了研究。模拟的目的是首先检查纳米银烧结模贴附过程造成的热导率降低多少。其次,模拟还将研究石墨烯对铜散热器的影响。模拟结果将显示200W LED模组的典型结构功能,热阻降低高达7%。还将检查模块的中心与边缘温差温度作为比较散热能力的标准。此外,仿真将提供LED模块各部分在稳态条件下的温度,作为可靠性的指示。
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Thermal Simulations of a UV LED module with nanosilver sintered die attach process on graphene-coated copper substrates
The industrial market has been growing for high-power ultraviolet (UV) LEDs in curing, water purifying, and other applications that required high light output. As a rule of thumb, LED lumen output usually drops 0.3–0.5% for each 1°C increase in temperature while operating within the typical working temperature range. Such requirements for high-power UV LED modules indicate that innovative materials and processes for module packaging are needed to reduce thermal conductivity and to ensure high reliability.In this work, UVA (wavelengths between 365–405nm) LEDs were chosen, since the increasing usage in curing equipment for drying paints, adhesives, and other curable materials. In order to reduce the thermal conductivity of UVA LED packages, a high power UV Chip on Board (COB) based LED module was simulated. Compared with traditional modules using silver-filled adhesive and metal-core printed circuit boards(MCPCB) substrate, the novel high power UV COB based module was using nano-silver material for die attach process. Such silver sintering method is emerging for high power electronics applications. Such substrate is then sintered on copper heatsink which is covered by a thin layer of graphene, for better thermal management. Such novel structure was investigated using ABAQUS software and the Heat Transfer Module. The simulation is intended to first check how much thermal conductivity reduce caused by nanosilver sinter die attach process. Secondly, the simulation will also investigate the graphene influence on the copper heatsink. Results from the simulation will show the typical structural function of a 200W LED module with reduced thermal resistance up to 7%. The module temperature with edge-to-center temperature difference will also be checked as a standard to compare the heat dissipation capacity. Besides, the simulation will provide temperatures in various parts of the LED module in steady-state conditions, as an indication for reliability.
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