S. Phurikhup, S. Pruettipongsapuk, K. Sirivathanant
{"title":"记忆测试仪在快闪记忆装置微裂纹及裂纹模式无损检测中的应用","authors":"S. Phurikhup, S. Pruettipongsapuk, K. Sirivathanant","doi":"10.1109/IPFA.2003.1222743","DOIUrl":null,"url":null,"abstract":"In this paper, we introduces a new , non-destructive inspection technique for die crack and crack pattern using a memory tester. The concept of the technique is based upon the fact that almost ninety percent of the space of a memory device consists of cell memories, thus if microcrack is present, the phenomenon would cause malfunctioning of the memory.","PeriodicalId":266326,"journal":{"name":"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2003-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Application of memory tester for non-destructive detection of micro-crack and crack patterns in flash memory devices\",\"authors\":\"S. Phurikhup, S. Pruettipongsapuk, K. Sirivathanant\",\"doi\":\"10.1109/IPFA.2003.1222743\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we introduces a new , non-destructive inspection technique for die crack and crack pattern using a memory tester. The concept of the technique is based upon the fact that almost ninety percent of the space of a memory device consists of cell memories, thus if microcrack is present, the phenomenon would cause malfunctioning of the memory.\",\"PeriodicalId\":266326,\"journal\":{\"name\":\"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-07-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2003.1222743\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2003.1222743","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Application of memory tester for non-destructive detection of micro-crack and crack patterns in flash memory devices
In this paper, we introduces a new , non-destructive inspection technique for die crack and crack pattern using a memory tester. The concept of the technique is based upon the fact that almost ninety percent of the space of a memory device consists of cell memories, thus if microcrack is present, the phenomenon would cause malfunctioning of the memory.