高速设计中封装和互连模型分析的模型简化技术综述

Electrical Performance of Electronic Packaging Pub Date : 1997-10-27 DOI:10.1109/EPEP.1997.634082

E. Chiprout, T. Nguyen

引用次数: 4

摘要

概述了用于仿真的线性互连和封装模型的模型约简技术的最新进展。强调了不同方法对准确性、稳定性和通用性的重要性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Survey of model reduction techniques for analysis of package and interconnect models of high-speed designs

An overview of the recent advances in model reduction techniques of linear interconnect and packaging models for the purpose of simulation is given. The importance of different methods for accuracy, stability and generality are highlighted.

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Electrical Performance of Electronic Packaging

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