{"title":"cofire陶瓷电子封装制造物流","authors":"T. Carr","doi":"10.1109/IEMT.1996.559750","DOIUrl":null,"url":null,"abstract":"The manufacturing cycletime of cofire ceramic Pin Grid Array (PGA) electronic packages has been modeled using the principles of chemical kinetics. In this paper, the rates and mechanisms of chemical reactions are discussed in relation to the manufacturing cycletime. Alcoa Electronic Packaging has used this methodology to achieve world class status in the manufacturing of Pin Grid Array electronic packages.","PeriodicalId":177653,"journal":{"name":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The manufacturing logistics of cofire ceramic electronic packages\",\"authors\":\"T. Carr\",\"doi\":\"10.1109/IEMT.1996.559750\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The manufacturing cycletime of cofire ceramic Pin Grid Array (PGA) electronic packages has been modeled using the principles of chemical kinetics. In this paper, the rates and mechanisms of chemical reactions are discussed in relation to the manufacturing cycletime. Alcoa Electronic Packaging has used this methodology to achieve world class status in the manufacturing of Pin Grid Array electronic packages.\",\"PeriodicalId\":177653,\"journal\":{\"name\":\"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1996.559750\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1996.559750","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The manufacturing logistics of cofire ceramic electronic packages
The manufacturing cycletime of cofire ceramic Pin Grid Array (PGA) electronic packages has been modeled using the principles of chemical kinetics. In this paper, the rates and mechanisms of chemical reactions are discussed in relation to the manufacturing cycletime. Alcoa Electronic Packaging has used this methodology to achieve world class status in the manufacturing of Pin Grid Array electronic packages.
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