{"title":"一个实用的测试和诊断方法，部分可测试的mcm","authors":"M. Lubaszewski, M. Marzouki, M. H. Touati","doi":"10.1109/MCMC.1994.292518","DOIUrl":null,"url":null,"abstract":"Current MCM market cannot afford yet 100% product testability. This paper presents a way to get along with partial testability. Under the assumption that module-level boundary scan is available and that, at the chip-level, it is only implemented in some of the dies, we propose a methodology for simultaneous test and diagnosis of boundary scan and non boundary scan parts.<<ETX>>","PeriodicalId":292463,"journal":{"name":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","volume":"170 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-03-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":"{\"title\":\"A pragmatic test and diagnosis methodology for partially testable MCMs\",\"authors\":\"M. Lubaszewski, M. Marzouki, M. H. Touati\",\"doi\":\"10.1109/MCMC.1994.292518\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Current MCM market cannot afford yet 100% product testability. This paper presents a way to get along with partial testability. Under the assumption that module-level boundary scan is available and that, at the chip-level, it is only implemented in some of the dies, we propose a methodology for simultaneous test and diagnosis of boundary scan and non boundary scan parts.<<ETX>>\",\"PeriodicalId\":292463,\"journal\":{\"name\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"volume\":\"170 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1994-03-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"22\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MCMC.1994.292518\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Multi-Chip Module Conference (MCMC-94)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1994.292518","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A pragmatic test and diagnosis methodology for partially testable MCMs
Current MCM market cannot afford yet 100% product testability. This paper presents a way to get along with partial testability. Under the assumption that module-level boundary scan is available and that, at the chip-level, it is only implemented in some of the dies, we propose a methodology for simultaneous test and diagnosis of boundary scan and non boundary scan parts.<>
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
