基于甲基硅氧烷的多孔低钾薄膜的x射线孔隙度表征

H. Lee, C. Soles, D. Liu, B. Bauer, E. Lin, W. Wu
{"title":"基于甲基硅氧烷的多孔低钾薄膜的x射线孔隙度表征","authors":"H. Lee, C. Soles, D. Liu, B. Bauer, E. Lin, W. Wu","doi":"10.1109/IITC.2003.1219725","DOIUrl":null,"url":null,"abstract":"Methylsilsesquioxane based porous low-k dielectric films with different porogen loading have been characterized using X-ray porosimetry to determine their pore size distribution, average density, wall density and porosity. By varying the porogen content from 1 % to 30 %, the porosity and the average pore size changed from 12 % to 34 % and from 10 /spl Aring/ to 15 /spl Aring/ in radius, respectively. The wall density was found to be independent of the porogen content and it appeared that the porogen is not 100% effective in generating pores. Pore size of these samples was also obtained from small angle neutron scattering measurements and the results were found to be consistent with that from XRP.","PeriodicalId":212619,"journal":{"name":"Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Structural characterization of methylsilsesquioxane-based porous low-k thin films using X-ray porosimetry\",\"authors\":\"H. Lee, C. Soles, D. Liu, B. Bauer, E. Lin, W. Wu\",\"doi\":\"10.1109/IITC.2003.1219725\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Methylsilsesquioxane based porous low-k dielectric films with different porogen loading have been characterized using X-ray porosimetry to determine their pore size distribution, average density, wall density and porosity. By varying the porogen content from 1 % to 30 %, the porosity and the average pore size changed from 12 % to 34 % and from 10 /spl Aring/ to 15 /spl Aring/ in radius, respectively. The wall density was found to be independent of the porogen content and it appeared that the porogen is not 100% effective in generating pores. Pore size of these samples was also obtained from small angle neutron scattering measurements and the results were found to be consistent with that from XRP.\",\"PeriodicalId\":212619,\"journal\":{\"name\":\"Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-06-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC.2003.1219725\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC.2003.1219725","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

采用x射线孔隙率法对不同含孔率的甲基硅氧烷基多孔低k介电膜进行了表征,测定了其孔径分布、平均密度、壁密度和孔隙率。孔隙素含量在1% ~ 30%范围内变化,孔隙度和平均孔径半径分别从12% ~ 34%和10 /spl Aring/ ~ 15 /spl Aring/。壁密度与孔隙素含量无关,孔隙素并不是100%有效地形成孔隙。用小角中子散射法测定了样品的孔径,结果与XRP法一致。
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Structural characterization of methylsilsesquioxane-based porous low-k thin films using X-ray porosimetry
Methylsilsesquioxane based porous low-k dielectric films with different porogen loading have been characterized using X-ray porosimetry to determine their pore size distribution, average density, wall density and porosity. By varying the porogen content from 1 % to 30 %, the porosity and the average pore size changed from 12 % to 34 % and from 10 /spl Aring/ to 15 /spl Aring/ in radius, respectively. The wall density was found to be independent of the porogen content and it appeared that the porogen is not 100% effective in generating pores. Pore size of these samples was also obtained from small angle neutron scattering measurements and the results were found to be consistent with that from XRP.
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