{"title":"通过在多层中间平面上建模简化3D","authors":"Qian Li, K. Melde, G. Yeh, Hui Wu, Yaochao Yang","doi":"10.1109/EPEPS.2011.6100228","DOIUrl":null,"url":null,"abstract":"This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.","PeriodicalId":313560,"journal":{"name":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","volume":"79 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"3D via modeling simplification on multilayer mid-planes\",\"authors\":\"Qian Li, K. Melde, G. Yeh, Hui Wu, Yaochao Yang\",\"doi\":\"10.1109/EPEPS.2011.6100228\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.\",\"PeriodicalId\":313560,\"journal\":{\"name\":\"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems\",\"volume\":\"79 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-12-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS.2011.6100228\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2011.6100228","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
3D via modeling simplification on multilayer mid-planes
This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.