{"title":"NiAu表面处理下SnAgCu焊料互连的可靠性及失效分析","authors":"P. Ratchev, B. Vandevelde, I. De Wolf","doi":"10.1109/IPFA.2003.1222749","DOIUrl":null,"url":null,"abstract":"The authors study the reliability and failure mechanisms of eutectic SnAgCu solder interconnects on NiAu surface finish. As a comparision, the reliability and failure mechanism of standard SnPb solder joints on SiAu surface finish is studied as well. The similarities and differences in the failure modes for both solders are analysed and discussed.","PeriodicalId":266326,"journal":{"name":"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2003-07-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish\",\"authors\":\"P. Ratchev, B. Vandevelde, I. De Wolf\",\"doi\":\"10.1109/IPFA.2003.1222749\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The authors study the reliability and failure mechanisms of eutectic SnAgCu solder interconnects on NiAu surface finish. As a comparision, the reliability and failure mechanism of standard SnPb solder joints on SiAu surface finish is studied as well. The similarities and differences in the failure modes for both solders are analysed and discussed.\",\"PeriodicalId\":266326,\"journal\":{\"name\":\"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-07-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2003.1222749\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2003.1222749","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish
The authors study the reliability and failure mechanisms of eutectic SnAgCu solder interconnects on NiAu surface finish. As a comparision, the reliability and failure mechanism of standard SnPb solder joints on SiAu surface finish is studied as well. The similarities and differences in the failure modes for both solders are analysed and discussed.