高速半绝缘GaInAsP激光加工

J. Wasserbauer, T. Fukushima, J. Bowers, S. Zehr, R. Haung
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引用次数: 0

摘要

半绝缘(SI)平面埋置异质结构(SIPBH)激光器,旨在减少器件寄生,已制成高速运行。在高速激光操作的高温下,研究了用于电流阻挡层的掺铁SI - InP的I-V特性。发现阱填充电压V/sub TF/随温度升高而线性降低。然而,在室温为70 V时,具有V/sub TF/的SI InP层在超过150℃的温度下显示出电流阻塞特性。
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High speed semi-insulating GaInAsP laser processing
Semi-insulating (SI) planar buried heterostructure (SIPBH) lasers, designed to minimize device parasitics, have been fabricated for high-speed operation. The I-V characteristics of the Fe-doped SI InP employed for the current blocking layers were examined at elevated temperatures associated with high speed laser operation. It was found that the trap filled voltage, V/sub TF/, decreases linearly with increasing temperature. However, a SI InP layer with a V/sub TF/ at room temperature of 70 V demonstrated current blocking characteristics to temperatures in excess of 150 degrees C.<>
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