Non-oil bleed thermal gap fillers for long-term reliability of Solid State Drive

Liquid thermal gap fillers play a vital role in dissipating heat from electronic components to enclosure surfaces. However, oil bleed from silicone-based liquid thermal gap filler causes contamination on enclosure substrates. It is essential to develop a non-oil bleed, thermally reliable thermal gap filler for solid state drive (SSD). In this work, a novel two-part thermal gap filler was synthesized. The long-term stability and reliability of thermal gap filler were evaluated using a highly accelerated temperature and humidity stress test (HAST). Thermal conductivity of cured thermal gap fillers were investigated before and after HAST. It was found that newly formulated thermal gap filler was stable even at high temperature and high humidity environments. Thus, the newly formulated thermal gap filler can effectively dissipate heat and enhance the performance and reliability of SSD.