{"title":"几何图案设计和表面粗糙度对铜-铜键合热性能的影响","authors":"Kathleen Jerchel, T. Suga","doi":"10.23919/LTB-3D.2017.7947469","DOIUrl":null,"url":null,"abstract":"This paper functions as a feasibility study to prove increase of thermal performance of patterned Cu with an analytic model that takes into account the surface roughness. The thermal resistance is described as a function of the bonded surface area.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"683 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Influence of geometric pattern design and surface roughness on thermal performance of copper to copper bonding\",\"authors\":\"Kathleen Jerchel, T. Suga\",\"doi\":\"10.23919/LTB-3D.2017.7947469\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper functions as a feasibility study to prove increase of thermal performance of patterned Cu with an analytic model that takes into account the surface roughness. The thermal resistance is described as a function of the bonded surface area.\",\"PeriodicalId\":183993,\"journal\":{\"name\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"683 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/LTB-3D.2017.7947469\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947469","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Influence of geometric pattern design and surface roughness on thermal performance of copper to copper bonding
This paper functions as a feasibility study to prove increase of thermal performance of patterned Cu with an analytic model that takes into account the surface roughness. The thermal resistance is described as a function of the bonded surface area.
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