{"title":"电子应用导电胶粘剂的最新进展","authors":"C. Wong, D. Lu","doi":"10.1109/ADHES.2000.860585","DOIUrl":null,"url":null,"abstract":"As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more attention from the electronics industry. This new technology can offer numerous advantages over traditional soldering technology. However, some critical limitations of this technology has slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. In the past few years, there has been tremendous efforts in addressing these issues, and conductive adhesive technology has advanced significantly. This paper will give an overview of the main research work and achievements in conductive adhesive technology.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"285 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Recent advances in electrically conductive adhesives for electronics applications\",\"authors\":\"C. Wong, D. Lu\",\"doi\":\"10.1109/ADHES.2000.860585\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more attention from the electronics industry. This new technology can offer numerous advantages over traditional soldering technology. However, some critical limitations of this technology has slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. In the past few years, there has been tremendous efforts in addressing these issues, and conductive adhesive technology has advanced significantly. This paper will give an overview of the main research work and achievements in conductive adhesive technology.\",\"PeriodicalId\":222663,\"journal\":{\"name\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"volume\":\"285 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ADHES.2000.860585\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860585","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

摘要

导电胶接技术作为一种潜在的替代含铅焊接技术,越来越受到电子行业的重视。与传统焊接技术相比,这种新技术具有许多优点。然而,这项技术的一些关键限制已经减缓了它在电子工业中的潜在广泛应用。这些限制包括较低的导电性,在高温和高湿度老化期间增加接触电阻,以及较差的冲击性能。在过去的几年里,人们在解决这些问题方面做出了巨大的努力,导电胶粘剂技术取得了显著的进步。本文综述了导电胶粘剂技术的主要研究工作和取得的成果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Recent advances in electrically conductive adhesives for electronics applications
As a potential alternative to lead-bearing soldering technology, conductive adhesive technology has attracted more and more attention from the electronics industry. This new technology can offer numerous advantages over traditional soldering technology. However, some critical limitations of this technology has slowed its potentially wide applications in the electronics industry. These limitations include lower electrical conductivity, increased contact resistance during elevated temperature and humidity aging, and poor impact performance. In the past few years, there has been tremendous efforts in addressing these issues, and conductive adhesive technology has advanced significantly. This paper will give an overview of the main research work and achievements in conductive adhesive technology.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Electric field effects in the production of ICA joints Reliability of ACF in flip-chip with various bump heights Modeling of branched crosslinked composites, using the statistical polymer method Bismuth-filled anisotropically conductive adhesive for flip chip bonding A novel IMB technology for integrating active and passive components
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1