微扫描镜的机械和电气故障及可靠性

E. Gaumont, A. Wolter, H. Schenk, G. Georgelin, M. Schmoger
{"title":"微扫描镜的机械和电气故障及可靠性","authors":"E. Gaumont, A. Wolter, H. Schenk, G. Georgelin, M. Schmoger","doi":"10.1109/IPFA.2002.1025665","DOIUrl":null,"url":null,"abstract":"We present results of failure and reliability investigations on silicon Micro Scanning Mirrors. The electrical insulation resistance, mechanical shock resistance and long-run stability were characterized. By design optimization including a combination of filled and open insulation trenches we achieve an average insulation resistance of more than 10 G/spl Omega/ at 20 V. The experimental data from devices with an eigenfrequency between 270 Hz and 350 Hz show that they withstand a shock acceleration of more than 6900 g in 3 axes when not operated and of 2500 g at least when operated. This remarkably results are due to several optimized design aspects. In long-run tests with high deflection angles the springs were exposed to a torsional stress of up to 1.5 GPa for more than 1.6/spl times/10/sup 9/ periods. No failure or significant change of the eigenfrequency was observed.","PeriodicalId":328714,"journal":{"name":"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Mechanical and electrical failures and reliability of Micro Scanning Mirrors\",\"authors\":\"E. Gaumont, A. Wolter, H. Schenk, G. Georgelin, M. Schmoger\",\"doi\":\"10.1109/IPFA.2002.1025665\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We present results of failure and reliability investigations on silicon Micro Scanning Mirrors. The electrical insulation resistance, mechanical shock resistance and long-run stability were characterized. By design optimization including a combination of filled and open insulation trenches we achieve an average insulation resistance of more than 10 G/spl Omega/ at 20 V. The experimental data from devices with an eigenfrequency between 270 Hz and 350 Hz show that they withstand a shock acceleration of more than 6900 g in 3 axes when not operated and of 2500 g at least when operated. This remarkably results are due to several optimized design aspects. In long-run tests with high deflection angles the springs were exposed to a torsional stress of up to 1.5 GPa for more than 1.6/spl times/10/sup 9/ periods. No failure or significant change of the eigenfrequency was observed.\",\"PeriodicalId\":328714,\"journal\":{\"name\":\"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)\",\"volume\":\"5 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2002.1025665\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2002.1025665","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

摘要

本文介绍了硅微扫描镜的失效和可靠性研究结果。对其电绝缘性能、机械抗震性和长期运行稳定性进行了表征。通过设计优化,包括填充和开放绝缘沟槽的组合,我们在20 V时实现了超过10 G/spl ω /的平均绝缘电阻。从特征频率在270 Hz和350 Hz之间的设备的实验数据表明,它们在不操作时承受3轴超过6900 g的冲击加速度,在操作时至少承受2500 g的冲击加速度。这个显著的结果是由于几个优化的设计方面。在大挠曲角度的长期测试中,弹簧承受高达1.5 GPa的扭转应力,超过1.6/spl次/10/sup /周期。没有观察到特征频率的失效或显著变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Mechanical and electrical failures and reliability of Micro Scanning Mirrors
We present results of failure and reliability investigations on silicon Micro Scanning Mirrors. The electrical insulation resistance, mechanical shock resistance and long-run stability were characterized. By design optimization including a combination of filled and open insulation trenches we achieve an average insulation resistance of more than 10 G/spl Omega/ at 20 V. The experimental data from devices with an eigenfrequency between 270 Hz and 350 Hz show that they withstand a shock acceleration of more than 6900 g in 3 axes when not operated and of 2500 g at least when operated. This remarkably results are due to several optimized design aspects. In long-run tests with high deflection angles the springs were exposed to a torsional stress of up to 1.5 GPa for more than 1.6/spl times/10/sup 9/ periods. No failure or significant change of the eigenfrequency was observed.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Reliability of copper dual damascene influenced by pre-clean Resistive interconnection localization Impact of oxide degradation on universal mobility behaviour of n-MOS inversion layers Through-silicon IR image to CAD database alignment Correlation between hot carrier stress, oxide breakdown and gate leakage current for monitoring plasma processing induced damage on gate oxide
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1