使用大气压溅射的恶劣环境应用的铂互连

2022 International Conference on Electronics Packaging (ICEP) Pub Date : 2022-05-11 DOI:10.23919/ICEP55381.2022.9795437

J. Bickel, M. Schneider-Ramelow, K.-D. Lang, R. Gesche, H. Ngo

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引用次数: 0

摘要

对于常压溅射技术，直接在Al2O3陶瓷衬底上沉积薄而高导电性的铂层。采用细丝键合的方法可以确定必要的工艺参数，并实现层间的接触。随后在500℃下储存10小时，机械粘合性能没有退化。

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Platinum interconnections for harsh environment applications using atmospheric pressure sputtering

For the atmospheric pressure sputtering technology, directly structured thin- and highly conductive layers of platinum were additively deposited on Al2O3 ceramic substrate. The necessary process parameters could be identified and the layers could be contacted by using thin-wire bonding. A subsequent storage for 10 h at 500 °C shows no degeneration of the mechanical bonding properties.

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2022 International Conference on Electronics Packaging (ICEP)

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