Linghan Li, A. Higo, M. Kubota, M. Sugiyama, Y. Nakano
{"title":"一种新型的硅基三维纳米结构蚀刻氧化制备方法及其在SOI对称波导和三维锥形光斑尺寸变换器中的应用","authors":"Linghan Li, A. Higo, M. Kubota, M. Sugiyama, Y. Nakano","doi":"10.1109/OMEMS.2008.4607811","DOIUrl":null,"url":null,"abstract":"A novel etching and oxidation method utilizing space effect of dry etching for three dimensional silicon structure is presented. Testing devices of SOI symmetric waveguide with ultra thick SiO2 cladding and silicon waveguide structure integrated with 3D taper spot size converter are fabricated using this method.","PeriodicalId":402931,"journal":{"name":"2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics","volume":"72 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-08-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"A novel etching-oxidation fabrication method for 3D nano structures on silicon and its application to SOI symmetric waveguide and 3D taper spot size converter\",\"authors\":\"Linghan Li, A. Higo, M. Kubota, M. Sugiyama, Y. Nakano\",\"doi\":\"10.1109/OMEMS.2008.4607811\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel etching and oxidation method utilizing space effect of dry etching for three dimensional silicon structure is presented. Testing devices of SOI symmetric waveguide with ultra thick SiO2 cladding and silicon waveguide structure integrated with 3D taper spot size converter are fabricated using this method.\",\"PeriodicalId\":402931,\"journal\":{\"name\":\"2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics\",\"volume\":\"72 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-08-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/OMEMS.2008.4607811\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 IEEE/LEOS International Conference on Optical MEMs and Nanophotonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/OMEMS.2008.4607811","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A novel etching-oxidation fabrication method for 3D nano structures on silicon and its application to SOI symmetric waveguide and 3D taper spot size converter
A novel etching and oxidation method utilizing space effect of dry etching for three dimensional silicon structure is presented. Testing devices of SOI symmetric waveguide with ultra thick SiO2 cladding and silicon waveguide structure integrated with 3D taper spot size converter are fabricated using this method.