P. Solomon, D. Frank, J. Jopling, C. D'Emic, O. Dokumaci, P. Ronsheim, W. Haensch
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引用次数: 12
摘要
对离子注入PN结二极管的带间隧道效应进行了实验研究,该二极管具有代表当前和未来硅CMOS晶体管的轮廓。测量是在很宽的温度和植入物参数范围内完成的。从CV特征分析中得出剖面参数,并与SIMS分析进行比较。当隧道电流与隧道距离(隧道距离,修正了带曲率)的关系时,发现隧道电流随隧道距离的准普遍指数减少,衰减长度为0.38 nm,并且在300 K时,零隧道距离时的外推隧道电流为5.3/spl乘以/10/sup 7/ a /cm/sup 2/。这些结果被用于估计未来规模CMOS的漏极-衬底电流,并得出结论,如果没有更多的创新和器件设计变化,要对低工作功率和低待机功率选项进行ITRS 2002路线图预测将是具有挑战性的。
Tunnel current measurements on P/N junction diodes and implications for future device design
Band-to-band tunneling was studied experimentally in ion-implanted PN junction diodes with profiles representative of present and future silicon CMOS transistors. Measurements were done over a wide range of temperatures and implant parameters. Profile parameters were derived from analysis of CV characteristics, and compared to SIMS analysis. When tunneling current was plotted against distance (tunneling distance, corrected for band curvature) a quasi-universal exponential reduction of tunneling current vs. tunneling distance was found with an attenuation length of 0.38 nm, and an extrapolated tunneling current at zero tunnel distance of 5.3/spl times/10/sup 7/ A/cm/sup 2/ at 300 K. These results were used to estimate drain-substrate currents in future scaled CMOS, and it was concluded that it will be challenging to make the ITRS 2002 roadmap projections on leakage current for the low operating power and low standby power options without more innovation and device design changes.