C. Moulin, D. Delprat, C. Maleville, W. Mcmillan, J. Payne, K. Bird well, R. Brun, R. Moirin
{"title":"紫外扫描监测SOI缺陷","authors":"C. Moulin, D. Delprat, C. Maleville, W. Mcmillan, J. Payne, K. Bird well, R. Brun, R. Moirin","doi":"10.1109/SOI.2005.1563569","DOIUrl":null,"url":null,"abstract":"This paper shows how a new generation of inspection system enables us to monitor SOI as requested in the ITRS roadmaps; it shows also the large amount of key information we can collect, giving us important feedback on the SOI process.","PeriodicalId":116606,"journal":{"name":"2005 IEEE International SOI Conference Proceedings","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"UV scanning for SOI defectivity monitoring\",\"authors\":\"C. Moulin, D. Delprat, C. Maleville, W. Mcmillan, J. Payne, K. Bird well, R. Brun, R. Moirin\",\"doi\":\"10.1109/SOI.2005.1563569\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper shows how a new generation of inspection system enables us to monitor SOI as requested in the ITRS roadmaps; it shows also the large amount of key information we can collect, giving us important feedback on the SOI process.\",\"PeriodicalId\":116606,\"journal\":{\"name\":\"2005 IEEE International SOI Conference Proceedings\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-12-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 IEEE International SOI Conference Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOI.2005.1563569\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE International SOI Conference Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOI.2005.1563569","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper shows how a new generation of inspection system enables us to monitor SOI as requested in the ITRS roadmaps; it shows also the large amount of key information we can collect, giving us important feedback on the SOI process.