J. Derakhshandeh, D. La Tulipe, G. Capuz, V. Cherman, C. Gerets, T. Cochet, E. Shafahian, I. D. Preter, G. Jamieson, T. Webers, E. Beyne, G. Beyer, Andy Miller
{"title":"用于低温和高通量D2W键合的受限imc","authors":"J. Derakhshandeh, D. La Tulipe, G. Capuz, V. Cherman, C. Gerets, T. Cochet, E. Shafahian, I. D. Preter, G. Jamieson, T. Webers, E. Beyne, G. Beyer, Andy Miller","doi":"10.23919/ICEP55381.2022.9795565","DOIUrl":null,"url":null,"abstract":"In this paper an integration flow is introduced for IMC insertion bonding, enabling stacking microbumps with 10um and below pitches. Confined CoSn3 pre-IMC bumps inside the cavities prevent lateral IMC growth and provide mechanical connection between Sn and sharp IMC grains during low temperature TCB process and improve the alignment. Electrical yield of 95% is obtained for single bumps connection of 20, 10 and 7um pitch bumps.","PeriodicalId":413776,"journal":{"name":"2022 International Conference on Electronics Packaging (ICEP)","volume":"553 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Confined IMCs for low temperature and high throughput D2W bonding\",\"authors\":\"J. Derakhshandeh, D. La Tulipe, G. Capuz, V. Cherman, C. Gerets, T. Cochet, E. Shafahian, I. D. Preter, G. Jamieson, T. Webers, E. Beyne, G. Beyer, Andy Miller\",\"doi\":\"10.23919/ICEP55381.2022.9795565\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper an integration flow is introduced for IMC insertion bonding, enabling stacking microbumps with 10um and below pitches. Confined CoSn3 pre-IMC bumps inside the cavities prevent lateral IMC growth and provide mechanical connection between Sn and sharp IMC grains during low temperature TCB process and improve the alignment. Electrical yield of 95% is obtained for single bumps connection of 20, 10 and 7um pitch bumps.\",\"PeriodicalId\":413776,\"journal\":{\"name\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"volume\":\"553 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 International Conference on Electronics Packaging (ICEP)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/ICEP55381.2022.9795565\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 International Conference on Electronics Packaging (ICEP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/ICEP55381.2022.9795565","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Confined IMCs for low temperature and high throughput D2W bonding
In this paper an integration flow is introduced for IMC insertion bonding, enabling stacking microbumps with 10um and below pitches. Confined CoSn3 pre-IMC bumps inside the cavities prevent lateral IMC growth and provide mechanical connection between Sn and sharp IMC grains during low temperature TCB process and improve the alignment. Electrical yield of 95% is obtained for single bumps connection of 20, 10 and 7um pitch bumps.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
