{"title":"有限元接触单元技术及其在金属引线成形失效分析中的应用","authors":"Lam Tim Fai","doi":"10.1109/IPFA.2002.1025610","DOIUrl":null,"url":null,"abstract":"FEA contact element technique has been established and was successfully applied to metal lead forming simulation. One of the commonly encountered lead finish defects, the lead shift problem, was studied in more detail. The results clearly show that the lead shift is due to the unsymmetrical profile of the lead frame used. The FEA results are in good accordance with the experimental measurement.","PeriodicalId":328714,"journal":{"name":"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"FEA contact element technique and its applications in metal lead forming failure analysis\",\"authors\":\"Lam Tim Fai\",\"doi\":\"10.1109/IPFA.2002.1025610\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"FEA contact element technique has been established and was successfully applied to metal lead forming simulation. One of the commonly encountered lead finish defects, the lead shift problem, was studied in more detail. The results clearly show that the lead shift is due to the unsymmetrical profile of the lead frame used. The FEA results are in good accordance with the experimental measurement.\",\"PeriodicalId\":328714,\"journal\":{\"name\":\"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2002.1025610\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2002.1025610","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
FEA contact element technique and its applications in metal lead forming failure analysis
FEA contact element technique has been established and was successfully applied to metal lead forming simulation. One of the commonly encountered lead finish defects, the lead shift problem, was studied in more detail. The results clearly show that the lead shift is due to the unsymmetrical profile of the lead frame used. The FEA results are in good accordance with the experimental measurement.
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