浮动散热片对高密度BGA封装的影响

52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) Pub Date : 2002-08-07 DOI:10.1109/ECTC.2002.1008348

V. Varadarajan, B.C. Kim, Dae-Hyun Han

{"title":"浮动散热片对高密度BGA封装的影响","authors":"V. Varadarajan, B.C. Kim, Dae-Hyun Han","doi":"10.1109/ECTC.2002.1008348","DOIUrl":null,"url":null,"abstract":"In this paper we present the effects of heat spreader on a ball grid array (BGA) package. We have simulated a fast switching CMOS inverter inside a BGA package with power, signal and ground planes. We performed simulations to study the effects of the electrical radiation and signal integrity with different configurations of heat spreader.","PeriodicalId":285713,"journal":{"name":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Effects of floating heat spreader in high density BGA packages\",\"authors\":\"V. Varadarajan, B.C. Kim, Dae-Hyun Han\",\"doi\":\"10.1109/ECTC.2002.1008348\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we present the effects of heat spreader on a ball grid array (BGA) package. We have simulated a fast switching CMOS inverter inside a BGA package with power, signal and ground planes. We performed simulations to study the effects of the electrical radiation and signal integrity with different configurations of heat spreader.\",\"PeriodicalId\":285713,\"journal\":{\"name\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2002.1008348\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2002.1008348","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

本文研究了热传导器对球栅阵列封装的影响。我们模拟了一个在BGA封装内的快速开关CMOS逆变器，包括电源、信号和地平面。通过仿真研究了不同散热片结构对电辐射和信号完整性的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Effects of floating heat spreader in high density BGA packages

In this paper we present the effects of heat spreader on a ball grid array (BGA) package. We have simulated a fast switching CMOS inverter inside a BGA package with power, signal and ground planes. We performed simulations to study the effects of the electrical radiation and signal integrity with different configurations of heat spreader.

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52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345)

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