工艺缺陷及其对栅极可靠性的影响

H. R. Bolin
{"title":"工艺缺陷及其对栅极可靠性的影响","authors":"H. R. Bolin","doi":"10.1109/IRPS.1980.362949","DOIUrl":null,"url":null,"abstract":"Gate failures are a significant factor in FET field failures. The role of defects (especially particulates) in the gate (thin dielectric) reliability failures on PET's has been previously studied. However, little or no data has been reported on defect size distributions, siting information (where they are located) and density distributions over varying device sizes and topologies. In addition, little is known about correlation of all these parameters to accelerated life test failures. This study was initiated to help provide some of this information.","PeriodicalId":270567,"journal":{"name":"18th International Reliability Physics Symposium","volume":"39 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1980-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Process Defects and Effects on Mosfet Gate Reliability\",\"authors\":\"H. R. Bolin\",\"doi\":\"10.1109/IRPS.1980.362949\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Gate failures are a significant factor in FET field failures. The role of defects (especially particulates) in the gate (thin dielectric) reliability failures on PET's has been previously studied. However, little or no data has been reported on defect size distributions, siting information (where they are located) and density distributions over varying device sizes and topologies. In addition, little is known about correlation of all these parameters to accelerated life test failures. This study was initiated to help provide some of this information.\",\"PeriodicalId\":270567,\"journal\":{\"name\":\"18th International Reliability Physics Symposium\",\"volume\":\"39 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1980-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"18th International Reliability Physics Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS.1980.362949\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"18th International Reliability Physics Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS.1980.362949","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

栅极失效是场效应管场失效的重要因素。缺陷(特别是颗粒)在PET栅极(薄介电介质)可靠性失效中的作用已经被研究过。然而,很少或没有关于缺陷尺寸分布、定位信息(它们所在的位置)和不同设备尺寸和拓扑结构上的密度分布的数据被报道。此外,人们对这些参数与加速寿命试验失效之间的关系知之甚少。这项研究的开始是为了帮助提供一些这样的信息。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Process Defects and Effects on Mosfet Gate Reliability
Gate failures are a significant factor in FET field failures. The role of defects (especially particulates) in the gate (thin dielectric) reliability failures on PET's has been previously studied. However, little or no data has been reported on defect size distributions, siting information (where they are located) and density distributions over varying device sizes and topologies. In addition, little is known about correlation of all these parameters to accelerated life test failures. This study was initiated to help provide some of this information.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Electromigration Resistance of Fine-Line Al for VLSI Applications Effects of Silicon Nitride Encapsulation on MOS Device Stability Reliability Analysis of Several Conductors at High Current Densities for use in Bubble Memories Reliability Testing and Evaluation of Magnetic Bubble Memories for Electronic Switching Systems Electromigration Failure in Hieavily Doped Polycrystalline Silicon
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1