用同步微衍射研究高锡合金薄膜的晶体织构及其对晶须生长的影响

P. Sarobol, A. Pedigo, J. Blendell, C. Handwerker, P. Su, Li Li, J. Xue
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引用次数: 8

摘要

对于电镀锡和锡合金表面,可靠性问题之一仍然是晶须生长的风险。最近的研究结果表明,晶须最有可能在薄膜中存在高应力或应力梯度的区域形成。如果能逐粒收集应变/应力分布信息,则可以进一步了解这些信息与晶须生长倾向之间的相关性。在这项工作中,我们利用来自同步加速器源的高度聚焦x射线束对一系列锡和含锡表面进行微衍射。x射线的高亮度和小光束尺寸能够生成逐粒的取向图以及单个颗粒的应变/应力水平。所分析的电镀饰面包括纯Sn、Sn-Cu和Sn-Cu-Pb饰面,其中含有不同浓度的Cu和Pb。镀层电流密度随镀层成分的变化而变化,并对镀层的纹理进行了比较。电镀后,这些表面处理被保存在环境条件下,并定期检查表面缺陷的形成。一旦观察到小丘或晶须生长,就用x射线扫描生长周围的区域。此外,还对这些样品进行了标准x射线衍射分析,并生成了反极图来比较样品的纹理。还生成了一个有限元模型来模拟饰面的纹理。通过实现饰面刚度矩阵,我们能够明确地实现饰面纹理的逐粒变化,从而评估饰面中的应变/应力分布。本研究的分析和模拟结果表明,电镀工艺参数(如电流密度)对镀层的晶体结构有显著影响。在相似的应变条件下,某些织构会在成品中产生更高的应力,从而导致更高水平的晶须生长。
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A synchrotron micro-diffraction investigation of crystallographic texture of high-Sn alloy films and its effects on whisker growth
For electroplated Sn and Sn alloy finishes, one of the reliability concerns remains the risk of whisker growth. Results from recent work have suggested that whiskers are most likely to form in regions of the films where high stress or a stress gradient exists. If strain/stress distribution information can be collected at a grain-by-grain level, correlations between such information and the propensity of whisker growth can be further understood. In this work, we utilized a highly focused X-ray beam from a synchrotron source to perform micro-diffraction on a series of Sn and Sn-containing finishes. The high brightness and small beam size of the X-ray enabled the generation of grain-by-grain orientation map as well as the strain/stress levels in individual grains. The electroplated finishes analyzed included pure Sn, Sn-Cu, and Sn-Cu-Pb finishes with various concentrations of Cu and Pb. Plating current density was also varied for each finish composition and the textures of these finishes were compared. After plating, these finishes were stored at ambient condition and examined regularly for surface defect formation. Once hillock or whisker growth was observed, the areas surrounding the growth were scanned with the X-ray. Additionally, these samples were also analyzed with standard X-ray diffraction and inverse pole figures were generated to compare the texture of the samples. A finite element model was also generated to simulate the texture of the finishes. By implementing the stiffness matrix of the finishes, we were able to explicitly implement the variation of finish texture on a grain-by-grain basis, and thus assess the strain/stress distribution in the finish. The analytical and simulation results from this study suggest that plating process parameters such as current density have a significant impact on the crystallographic texture of the plated finishes. Under similar strain conditions, certain textures would generate higher stresses in the finishes and result in higher levels of whisker growth.
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