{"title":"具有焊接性能的环氧胶粘剂","authors":"M. Lantzsch","doi":"10.1109/ADHES.2000.860593","DOIUrl":null,"url":null,"abstract":"There are two main advantages of epoxy resins with soldering properties: there are no more potentially harmful residues after soldering, and after the soldering process the epoxy residues act as a protective residue; the epoxy residues act as a mechanical reinforcement of the assembly (component + substrate). Epoxy resins with soldering properties can be classified in two groups of products: partial mechanical reinforcement around the specific solder joints; and full mechanical reinforcement beneath the body of the component.","PeriodicalId":222663,"journal":{"name":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","volume":"191 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-06-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Epoxy adhesives with soldering properties\",\"authors\":\"M. Lantzsch\",\"doi\":\"10.1109/ADHES.2000.860593\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"There are two main advantages of epoxy resins with soldering properties: there are no more potentially harmful residues after soldering, and after the soldering process the epoxy residues act as a protective residue; the epoxy residues act as a mechanical reinforcement of the assembly (component + substrate). Epoxy resins with soldering properties can be classified in two groups of products: partial mechanical reinforcement around the specific solder joints; and full mechanical reinforcement beneath the body of the component.\",\"PeriodicalId\":222663,\"journal\":{\"name\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"volume\":\"191 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-06-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ADHES.2000.860593\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing. Proceedings. Presented at Adhesives in Electronics 2000 (Cat. No.00EX431)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ADHES.2000.860593","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
There are two main advantages of epoxy resins with soldering properties: there are no more potentially harmful residues after soldering, and after the soldering process the epoxy residues act as a protective residue; the epoxy residues act as a mechanical reinforcement of the assembly (component + substrate). Epoxy resins with soldering properties can be classified in two groups of products: partial mechanical reinforcement around the specific solder joints; and full mechanical reinforcement beneath the body of the component.